Cohu has 50+ years of semiconductor test expertise designing and manufacturing pick-and-place, gravity feed, test-in-strip handlers, MEMS test cells, and turret-based test handling and back-end finishing equipment for ICs, LEDs and discrete components.
Our test handlers support a variety of package sizes and device types, including automotive, mobile, power, micro-electromechanical systems (MEMS) and microcontrollers, among others.
Best-in-class thermal accuracy for high parallelism applications; unique embedded sensor in individual contactors to enable fast calibration and closed-loop temp. control.
Unique T-Core active thermal control (ATC) technology dynamically removes heat from devices during testing to maintain thermal control, minimizes test time and yield loss.
Advanced motion control technology for fragile WLCSP testing on a low-cost configurable test handler.
High throughput handling solutions for WLCSPs and standard IC packages.
Integrated temperature controlled, intelligent contactors.
Leading provider of I4.0 ready solutions for semiconductor test and inspection.
Improving operational efficiency, workplace safety and automating repetitive work.
Thermal, vision and factory automation options.
Configurable OSAT Friendly Pick-and-Place Handler
Eclipse delivers scalable performance for testing a wide range of semiconductors.
High Parallel Tri-Temp Pick-and-Place Handler
MATRiX handler has a highly-flexible test site configuration that is well suited for a wide range of test applications
T-Core Active Thermal Control
Unique ATC technology that maximizes test yield.
Tri-Temp Pick-and-Place Handler
Universal handler for packages such as QFP, BGA, Micro-BGA, CSP, TSSOP, PLCC, PGA, LGA, MLP/MLF.
Extremely small to very large packages, very wide temperature range, high throughput octal site and quad site testing.
High Speed Gravity Handler
Well-established gravity test handler provides field proven reliability and performance.
Tube to Tube Gravity Handler
Gravity handler with the largest installed base, mature design and high reliability provides excellent cost of test.
Gravity Handler for Smallest Package
Modular designed gravity handler with various input and output possibilities.
High parallelism test in strip or singulated device batch handling on carriers, WLCSP post singulation.
High-Throughput Film Frame Handler
Designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages..
Solution for Test in Strip
The InCarrier process is based on a strip-like device carrier for single devices.
Loader / Unloader
Highly efficient and flexible loading / unloading of InCarrier, including vision inspection and final packaging.
High-Performance Strip Handler
Jaguar is designed for high-volume production testing of ICs on a strip format or in device carrier.
High-Performance Strip Handler
Designed for testing advanced semiconductor packages, LEDs, MEMs sensors, and traditional ICs.
Modular design based on standard handlers, high parallelism, ambient to automotive tri-temp handling.
MEMS Sensor Test Platform
All-in-one-system for loading, testing, calibration, final inspection and loading.
Innovative Concepts for the MEMS MarketCohu MEMS solutions combine the advantages of well-established and production-proven tri-temp test handling equipment with innovative concepts to meet the special requirements of the MEMS market.
The modular design concept allows the greatest flexibility for our customers as it allows ease of conversion between stimulus types. This flexibility and modularity provides the best return on investment by being able to react fast to market changes and accelerating time-to-market.
Cohu MEMS modules are available for a variety of sensor test applications, for singulated devices in various input media and also the unique and cost-efficient strip test in carriers, allowing the highest test parallelism in the market, and thus reducing cost of test.
Turret platforms for semiconductor test, inspection and packaging.
Highest Throughput for Fragile Devices
20-position turret platform for semiconductor test, inspection and packaging.
Highest Demanding Finishing Processes
32-position turret platform for semiconductor test, inspection and packaging.
Highest Inspection Yield for Wafer Level Packages and Bare Dies
32-position turret platform for semiconductor on film-frame wafer media.
Market Leading Inspection Yield with Uncompromised Throughput
Next generation inspection platform optimized for small, fragile semiconductors used in mobility and consumer applications
The High-Performance, AI-Driven Digital Twin Platform for Semiconductor Manufacturers that provides Real-time equipment monitoring and data analytics for Industry 4.0/Factory Automation.
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