Inspection and Metrology
Advanced vision with true infrared and AI-powered algorithms.
Full 6-Sides Inspection
All-surface visible inspection: Bottom, Backside and Sidewall dimensional and cosmetic inspection.
Cohu offers a wide range of solutions for inspection and packaging of:
- Singulated molded leaded and leadless devices
- Post-singulated wafer level chip scale packages (WLCSP) and bare dies
NV-Core is Cohu’s unique vision technology, enabling advanced inspection capabilities across Cohu’s handler portfolio. NV-Core’s latest advanced inspection and metrology technologies include innovative solutions such as 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection for sub-surface defect detection.
Customer Benefits
True Infrared Capability
Ability to see through silicon, inspecting the structure underneath the surface that is not otherwise observed with traditional vision inspection systems. Ability to detect inner-cracks.
True Ball Coplanarity
Dedicated algorithm generates a topographic view of devices using touchless 2D and 3D dimensional measurement inspections.
Microscale Defect Detection
High-resolution images combined with dedicated micro-crack algorithm for defect detection down to 5 µm.
Traceability Inspections
OCR / OCV, 1D/2D code, -and Wafer Quality Map.
Deep Learning
Integration of artificial intelligence algorithm to optimize further inspection yield by distinguishing micro-cracks from scratches.
NV-Core Inspection System
NV-Core Inspection System
Inspection to serve overall machine performance
Cohu’s unique vision technology, enabling advanced inspection capabilities across Cohu’s handler portfolio. NV-Core latest advanced inspection technologies include innovative solutions such as 3D Flex for 3-dimensional topographic inspection, sidewall micro-crack detection, and infrared inspection for sub-surface defect detection. In addition to device quality inspection, by mastering the “all-in-one” solution, Cohu can offer unique capabilities for handler’s diagnostics and alignments, that enable the highest productivity performance.
WLCSP Inspection
Neon
Market Leading Inspection Yield with Uncompromised Throughput
Next generation inspection platform optimized for small, fragile semiconductors used in mobility and consumer applications. Neon can handle fragile wafer level chip scale products at high speed, maintaining high operational efficiency while inspecting small devices down to 0.2 x 0.4 mm in size. It features extended process integration capabilities and can be configured with infrared and visual micro-scale defect inspection modules. It is also equipped with an external loader unloader to integrate with factory robots for customers adopting Industry 4.0 initiatives.
Package Inspection
Krypton
Tray to Tray and Tray to Tape
Full 6-sided inspection & metrology system for high-end semiconductor packages, based on its unique racetrack architecture combined with Cohu’s sophisticated NV-Core vision technology, it delivers state-of-theart inspection with up to 30% higher throughput and uptime compared to existing systems.
Ismeca NY20
Highest Throughput for Fragile Devices
20-position turret platform for semiconductors test, inspection and packaging, providing the highest quality yield and throughput. It integrates innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity. The NY20 also integrates with Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.
Ismeca NY32
Highest Demanding Finishing Processes
32-position turret platform for semiconductors test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity. The NY32 also integrates Cohu’s latest advanced inspection technologies such as 3D Flex for 3-dimensional topographic inspection and micro-crack detection algorithm with a high-resolution camera.
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